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MCP4651 数据表(PDF) 3 Page - Microchip Technology

部件名 MCP4651
功能描述  7/8-Bit Single/Dual I2C Digital POT with Nonvolatile Memory
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

MCP4651 数据表(HTML) 3 Page - Microchip Technology

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 2008-2013 Microchip Technology Inc.
DS22107B-page 3
MCP454X/456X/464X/466X
1.0
ELECTRICAL CHARACTERISTICS
1.1
Absolute Maximum Ratings†
Voltage on VDD with respect to VSS ........................................................................................................... -0.6V to +7.0V
Voltage on HVC/A0, A1, A2, SCL, SDA and WP with respect to VSS ....................................................... -0.6V to 12.5V
Voltage on all other pins (PxA, PxW, and PxB) with respect to VSS ..................................................-0.3V to VDD + 0.3V
Input clamp current, IIK (VI < 0, VI > VDD, VI > VPP ON HV pins)...........................................................................±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) ..................................................................................................±20 mA
Maximum output current sunk by any Output pin.................................................................................................... 25 mA
Maximum output current sourced by any Output pin ............................................................................................. 25 mA
Maximum current out of VSS pin ...........................................................................................................................100 mA
Maximum current into VDD pin ..............................................................................................................................100 mA
Maximum current into PXA, PXW & PXB pins ...................................................................................................... ±2.5 mA
Storage temperature ............................................................................................................................... -65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
Package power dissipation (TA = +50°C, TJ = +150°C)
MSSOP-8 ....................................................................................................................................................... 473 mW
MSSOP-10 ..................................................................................................................................................... 495 mW
DFN-8 (3x3) ......................................................................................................................................................1.76W
DFN-10 (3x3) .................................................................................................................................................... 1.87W
TSSOP-14......................................................................................................................................................... 1.00W
QFN-16 (4x4) .................................................................................................................................................... 2.18W
Soldering temperature of leads (10 seconds) ....................................................................................................... +300°C
ESD protection on all pins
4 kV (HBM),
300V (MM)
Maximum Junction Temperature (TJ) ................................................................................................................... +150°C
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended peri-
ods may affect device reliability.


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