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MCP4651 数据表(PDF) 3 Page - Microchip Technology |
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MCP4651 数据表(HTML) 3 Page - Microchip Technology |
3 / 102 page 2008-2013 Microchip Technology Inc. DS22107B-page 3 MCP454X/456X/464X/466X 1.0 ELECTRICAL CHARACTERISTICS 1.1 Absolute Maximum Ratings† Voltage on VDD with respect to VSS ........................................................................................................... -0.6V to +7.0V Voltage on HVC/A0, A1, A2, SCL, SDA and WP with respect to VSS ....................................................... -0.6V to 12.5V Voltage on all other pins (PxA, PxW, and PxB) with respect to VSS ..................................................-0.3V to VDD + 0.3V Input clamp current, IIK (VI < 0, VI > VDD, VI > VPP ON HV pins)...........................................................................±20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ..................................................................................................±20 mA Maximum output current sunk by any Output pin.................................................................................................... 25 mA Maximum output current sourced by any Output pin ............................................................................................. 25 mA Maximum current out of VSS pin ...........................................................................................................................100 mA Maximum current into VDD pin ..............................................................................................................................100 mA Maximum current into PXA, PXW & PXB pins ...................................................................................................... ±2.5 mA Storage temperature ............................................................................................................................... -65°C to +150°C Ambient temperature with power applied................................................................................................-40°C to +125°C Package power dissipation (TA = +50°C, TJ = +150°C) MSSOP-8 ....................................................................................................................................................... 473 mW MSSOP-10 ..................................................................................................................................................... 495 mW DFN-8 (3x3) ......................................................................................................................................................1.76W DFN-10 (3x3) .................................................................................................................................................... 1.87W TSSOP-14......................................................................................................................................................... 1.00W QFN-16 (4x4) .................................................................................................................................................... 2.18W Soldering temperature of leads (10 seconds) ....................................................................................................... +300°C ESD protection on all pins 4 kV (HBM), 300V (MM) Maximum Junction Temperature (TJ) ................................................................................................................... +150°C † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended peri- ods may affect device reliability. |
类似零件编号 - MCP4651 |
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类似说明 - MCP4651 |
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