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SI8425DB 数据表(PDF) 8 Page - Vishay Siliconix |
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SI8425DB 数据表(HTML) 8 Page - Vishay Siliconix |
8 / 11 page AN824 Vishay Siliconix Document Number: 71990 06-Jan-03 www.vishay.com 1 PCB Design and Assembly Guidelines For MICRO FOOTr Products Johnson Zhao INTRODUCTION Vishay Siliconix’s MICRO FOOT product family is based on a wafer-level chip-scale packaging (WL-CSP) technology that implements a solder bump process to eliminate the need for an outer package to encase the silicon die. MICRO FOOT products include power MOSFETs, analog switches, and power ICs. For battery powered compact devices, this new packaging technology reduces board space requirements, improves thermal performance, and mitigates the parasitic effect typical of leaded packaged products. For example, the 6−bump MICRO FOOT Si8902EDB common drain power MOSFET, which measures just 1.6 mm x 2.4 mm, achieves the same performance as TSSOP−8 devices in a footprint that is 80% smaller and with a 50% lower height profile (Figure 1). A MICRO FOOT analog switch, the 6−bump DG3000DB, offers low charge injection and 1.4 W on−resistance in a footprint measuring just 1.08 mm x 1.58 mm (Figure 2). Vishay Siliconix MICRO FOOT products can be handled with the same process techniques used for high-volume assembly of packaged surface-mount devices. With proper attention to PCB and stencil design, the device will achieve reliable performance without underfill. The advantage of the device’s small footprint and short thermal path make it an ideal option for space-constrained applications in portable devices such as battery packs, PDAs, cellular phones, and notebook computers. This application note discusses the mechanical design and reliability of MICRO FOOT, and then provides guidelines for board layout, the assembly process, and the PCB rework process. FIGURE 1. 3D View of MICRO FOOT Products Si8902DB and Si8900EDB FIGURE 2. Outline of MICRO FOOT CSP & Analog Switch DG3000DB 0.18 ~ 0.25 32 1 A B 0.5 1.58 0.5 0.285 0.285 1.08 |
类似零件编号 - SI8425DB |
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类似说明 - SI8425DB |
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