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MC33186DH1 数据表(PDF) 20 Page - Freescale Semiconductor, Inc |
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MC33186DH1 数据表(HTML) 20 Page - Freescale Semiconductor, Inc |
20 / 24 page Analog Integrated Circuit Device Data 20 Freescale Semiconductor 33186 ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 2.0) ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 2.0) Introduction This thermal addendum is provided as a supplement to the MC33186 technical datasheet. The addendum provides thermal performance information that may be critical in the design and development of system applications. All electrical, application, and packaging information is provided in the datasheet. Package and Thermal Considerations The MC33186 is offered in a 20 pin HSOP exposed pad, single die package. There is a single heat source (P), a single junction temperature (TJ), and thermal resistance (RJA). The stated values are solely for a thermal performance comparison of one package to another in a standardized environment. This methodology is not meant to and will not predict the performance of a package in an application- specific environment. Stated values were obtained by measurement and simulation according to the standards listed below. 20-PIN HSOP-EP 33186VW VW SUFFIX (Pb-FREE) 98ASH70273A 20-PIN HSOP-EP Note For package dimensions, refer to the 33186 data sheet. TJ = RJA . P Standards Notes: 1. Per JEDEC JESD51-2 at natural convection, still air condition. 2. 2s2p thermal test board per JEDEC JESD51-5 and JESD51-7. 3. Per JEDEC JESD51-8, with the board temperature on the center trace near the center lead. 4. Single layer thermal test board per JEDEC JESD51-3 and JESD51-5. 5. Thermal resistance between the die junction and the exposed pad surface; cold plate attached to the package bottom side, remaining surfaces insulated. Figure 28. Thermal Land Pattern for Direct Thermal Attachment According to JESD51-5 Table 6. Thermal Performance Comparison Thermal Resistance [ C/W] RJA (1), (2) 29 RJB (2), (3) 9.0 RJA (1), (4) 69 RJC (5) 2.0 1.0 1.0 0.2 0.2 * All measurements are in millimeters Soldermast openings Thermal vias connected to top buried plane 20 Pin HSOP-EP 1.6 mm Pitch 16.0 mm x 11.0 mm Body 12.3 mm x 7.1 mm Exposed Pad |
类似零件编号 - MC33186DH1 |
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类似说明 - MC33186DH1 |
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