ADG739 datasheet(6/12 Pages) AD

部件名	ADG739

功能描述	CMOS, Low-Voltage, 3-Wire Serially-Controlled, Matrix Switches

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制造商	AD [Analog Devices]

网页	http://www.analog.com

标志

6 / 12 page

–6–

REV. 0

ADG738/ADG739

ABSOLUTE MAXIMUM RATINGS

1

(TA = 25

°C unless otherwise noted.)

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Analog, Digital Inputs

2

. . . . . . . . . . –0.3 V to VDD + 0.3 V or

30 mA, Whichever Occurs First

Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA

(Pulsed at 1 ms, 10% Duty Cycle max)

Continuous Current, Each S . . . . . . . . . . . . . . . . . . . . . 30 mA

Continuous Current D, ADG739 . . . . . . . . . . . . . . . . . 80 mA

Continuous Current D, ADG738 . . . . . . . . . . . . . . . . 120 mA

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

TSSOP Package

θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . 150.4°C/W

θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . 27.6°C/W

Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300

°C

IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . . . . 220

°C

NOTES

1Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this speciﬁcation is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be

limited to the maximum ratings given.

TERMINOLOGY

CD, CS (ON) “ON” Switch Capacitance. Measured with refer-

ence to ground.

CIN

Digital Input Capacitance.

tON

Delay time between the 50% and 90% points

of the

SYNC rising edge and the switch “ON”

condition.

tOFF

Delay time between the 50% and 90% points

of the

SYNC rising edge and the switch “OFF”

condition.

tD

“OFF” time measured between the 80% points of

both switches when switching from one switch to

another.

Charge

A measure of the glitch impulse transferred from

Injection

the digital input to the analog output during

switching.

Off Isolation

A measure of unwanted signal coupling through

an “OFF” switch.

Crosstalk

A measure of unwanted signal which is coupled

through from one channel to another as a result

of parasitic capacitance.

Bandwidth

The frequency at which the output is attenuated

by 3 dBs.

On Response The frequency response of the “ON” switch.

Insertion

The loss due to the ON resistance of the switch.

Loss

VDD

Most Positive Power Supply Potential.

IDD

Positive Supply Current.

GND

Ground (0 V) Reference.

S

Source Terminal. May be an input or output.

D

Drain Terminal. May be an input or output.

VD (VS)

Analog Voltage on Terminals D, S.

RON

Ohmic Resistance between D and S.

∆RON

On Resistance Match Between any Two Chan-

nels, i.e., RONmax – RONmin.

RFLAT(ON)

Flatness is deﬁned as the difference between the

maximum and minimum value of on resistance

as measured over the speciﬁed analog signal range.

IS (OFF)

Source Leakage Current with the Switch “OFF.”

ID (OFF)

Drain Leakage Current with the Switch “OFF.”

ID, IS (ON)

Channel Leakage Current with the Switch “ON.”

VINL

Maximum Input Voltage for Logic “0.”

VINH

Minimum Input Voltage for Logic “1.”

IINL(IINH)

Input Current of the Digital Input.

CS (OFF)

“OFF” Switch Source Capacitance. Measured

with reference to ground.

CD (OFF)

“OFF” Switch Drain Capacitance. Measured

with reference to ground.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the ADG738/ADG739 feature proprietary ESD protection circuitry, permanent damage may occur

on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions

are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

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