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ST0603CG8R2G251 Datasheet(数据表) 9 Page - MERITEK ELECTRONICS CORPORATION

部件型号  ST0603CG8R2G251
说明  Soft Termination Multilayer Ceramic Chip Capacitors
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制造商  MERITEK [MERITEK ELECTRONICS CORPORATION]
网页  http://www.meritekusa.com
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 9 page
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No.
Item
Test Condition
Requirements
1. Visual and
Mechanical
---
* No remarkable defect.
* Dimensions to conform to individual specification sheet.
2. Capacitance
* Shall not exceed the limits given in the detailed spec.
3. Q/ D.F.
(Dissipation
Factor)
Class I: (NP0)
Cap≤1000pF, 1.0±0.2Vrms, 1MHz±10%
Cap>1000pF, 1.0±0.2Vrms, 1KHz±10%
Class II: (X7R)
1.0±0.2Vrms, 1kHz±10%
NP0: Cap≥30pF, Q≥1000; Cap<30pF, Q≥400+20C
X7R: ≤2.5%
4. Temperature
Coefficient
With no electrical load.
T.C.
Operating Temp
NP0
-55~125°C at 25°C
X7R
-55~125°C at 25°C
T.C.
Capacitance Change
NPO
Within ±30ppm/°C
X7R
Within ±15%
5. Insulation
Resistance
UR=100V: To apply voltage at UR for max. 120 sec.
UR>100V: To apply voltage at UR (500V max.) for 60
sec.
Class I (NP0)
: ≥100G or RxC≥1000 -F whichever is smaller.
Class II (X7R)
: ≥10G or RxC≥500 -F whichever is smaller.
6. Dielectric
Strength
* To apply voltage:
100V
=2.5 times of UR
200V/250V
=2 times of UR
500V
=1.5 times of UR
> 500V
=1.2 times of UR
* Duration: 1 to 5 sec.
* No evidence of damage or flashover during test.
7. Solderability * Solder temperature: 235±5°C
* Dipping time: 2±0.5 sec.
NPO:95% min. coverage of all metalized area.
X7R:75% min. coverage of all metalized area.
8. Resistance
to Soldering
Heat
* Solder temperature: 260±5°C
* Dipping time: 10±1 sec
* Preheating: 120 to 150°C for 1 minute before
immerse the capacitor in a eutectic solder.
* Before initial measurement : Perform 150+0/-10°C
for 1 hr and then set for 48±4 hrs at room temp.
* Measurement to be made after keeping at room
temp. for 24±2hrs (Class I) or 48±4 hrs (Class II)
* No remarkable damage.
* Cap change:
NP0: within ±2.5% or ±0.25pF whichever is larger.
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
X7R:
within ±15%
* 25% max. leaching on each edge.
9. Temperature
Cycle
* Conduct the five cycles according to the
temperatures and time.
Step
Temp. (°C)
Time (min.)
1
Min. operating temp. +0/-3
30±3
2
Room temp.
2~3
3
Max. operating temp. +3/-0
30±3
4
Room temp.
2~3
* Before initial measurement : Perform 150+0/-10°C
for 1 hr and then set for 48±4 hrs at room temp.
* Measurement to be made after keeping at room
temp. for 24±2 hrs. (Class I) or 48±4 hrs (Class II)
* No remarkable damage.
* Cap change:
NP0: within ±2.5% or ±0.25pF whichever is larger.
X7R: within ±15%
* Q/D.F.:
X7R: ≤1.5 × Initial requirement
* I.R.≥ 0.25 × initial requirements.
10. Humidity
(Damp Heat)
Steady State
* Test temp.: 40±2°C
* Humidity: 90~95% RH
* Test time: 500+24/-0hrs.
* Measurement to be made after keeping at room
temp. for 24±2 hrs. (Class I) or 48±4 hrs (Class II)
* No remarkable damage.
* Cap change:
NP0: within ±5.0% or ±0.5pF whichever is larger.
X7R :within ±15%
Q/D.F Value:
NP0: Cap≥30pF, Q≥350; 10pF≤Cap<30pF, Q≥275+2.5C
Cap<10pF; Q≥200+10C
X7R:
≤7.0%
* I.R.: ≥1G or RxC≥50 -F whichever is smaller.
Soft Termination Multilayer
Ceramic Chip Capacitors
RoHS
MERITEK
ST Series
RELIABILITY TEST CONDITIONS AND REQUIREMENTS
Rev.7




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