AD8013

Model

AD8013A

Conditions

Min

Typ

Max

Units

POWER SUPPLY

Operating Range

Single Supply

+4.2

+13

V

Dual Supply

±2.1

±6.5

V

Quiescent Current/Amplifier

+5 V

3.0

3.5

mA

±5 V

3.4

4.0

mA

±6.5 V

3.5

mA

Quiescent Current/Amplifier

Power Down

+5 V

0.25

0.35

mA

±5 V

0.3

0.4

mA

Power Supply Rejection Ratio

Input Offset Voltage

±2.5 V to ±5 V

70

76

dB

–Input Current

+5 V,

±5 V

0.03

0.2

µA/V

+Input Current

+5 V,

±5 V

0.07

1.0

µA/V

DISABLE CHARACTERISTICS

Off Isolation

f = 6 MHz

+5 V,

±5 V

–70

dB

Off Output Impedance

G = +1

+5 V,

±5 V

12

pF

Turn-On Time

50

ns

Turn-Off Time

30

ns

Switching Threshold

1.3

1.6

1.9

V

NOTES

Specifications subject to change without notice.

–3–

REV. A

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage

. . . . . . . . . . . . . . . . . . . . . . . . . . 13.2 V Total

Internal Power Dissipation

2

Plastic (N) . . . . . . . . . 1.6 Watts (Observe Derating Curves)

Small Outline (R) . . . . 1.0 Watts (Observe Derating Curves)

Input Voltage (Common Mode) . . Lower of

±V

±12.25 V

Differential Input Voltage . . . . . . . . Output

±6 V (Clamped)

Output Voltage Limit

Output Short Circuit Duration

. . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves

Storage Temperature Range

N and R Package . . . . . . . . . . . . . . . . . . . –65

°C to +125°C

Operating Temperature Range

AD8013A . . . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +85°C

Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300

°C

NOTES

permanent damage to the device. This is a stress rating only and functional

operation of the device at these or any other conditions above those indicated in

the operational section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

14-Pin Plastic DIP Package:

θ

14-Pin SOIC Package:

θ

ORDERING GUIDE

Temperature

Package

Package

Model

Range

Description

Options

AD8013AN

–40

°C to +85°C 14-Pin Plastic DIP N-14

AD8013AR-14

–40

°C to +85°C 14-Pin Plastic SOIC R-14

AD8013AR-14-REEL

–40

°C to +85°C 14-Pin Plastic SOIC R-14

AD8013AR-14-REEL7

–40

°C to +85°C 14-Pin Plastic SOIC R-14

AD8013ACHIPS

–40

°C to +85°C Die Form

Maximum Power Dissipation

The maximum power that can be safely dissipated by the AD8013

is limited by the associated rise in junction temperature. The

maximum safe junction temperature for the plastic encapsulated

parts is determined by the glass transition temperature of the

plastic, about 150

°C. Exceeding this limit temporarily may

cause a shift in parametric performance due to a change in the

stresses exerted on the die by the package. Exceeding a junction

temperature of 175

°C for an extended period can result in

device failure.

While the AD8013 is internally short circuit protected, this may

not be enough to guarantee that the maximum junction temper-

ature is not exceeded under all conditions. To ensure proper

operation, it is important to observe the derating curves.

It must also be noted that in (noninverting) gain configurations

(with low values of gain resistor), a high level of input overdrive

can result in a large input error current, which may result in a

significant power dissipation in the input stage. This power

must be included when computing the junction temperature rise

due to total internal power.

AMBIENT TEMPERATURE –

°C

2.5

2.0

0.5

–50

90

–40 –30 –20

0

10 20

30

40 50

60 70

80

1.5

1.0

–10

14-PIN DIP PACKAGE

14-PIN SOIC

Maximum Power Dissipation vs. Ambient Temperature