© 2007 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN2103 • Rev. 1.0.8

4

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Parameter

Conditions

Min.

Max.

Unit

VIN to PGND

28

V

VCC to AGND

AGND = PGND

6

V

BOOT to PGND

35

V

BOOT to SW

-0.3

6.0

V

SW to PGND

Transient (t < 20 ns, f < 600 KHz)

-5

30

V

All other pins

-0.3

V

ESD

Human Body Model, JEDEC JESD22-A114

2.0

kV

Charged Device Model, JEDEC JESD22-C101

2.5

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to absolute maximum ratings.

Symbol

Parameter

Conditions

Min.

Typ.

Max.

Unit

Bias Voltage

VCC to AGND

4.5

5.0

5.5

V

Supply Voltage

VIN to PGND

3

24

V

Ambient Temperature

FAN2103M

-10

+85

°C

FAN2103EM

-40

+85

°C

Junction Temperature

+125

°C

Thermal Information

Symbol

Parameter

Min.

Typ.

Max.

Unit

Storage Temperature

-65

+150

°C

Lead Soldering Temperature, 10 Seconds

+300

°C

Vapor Phase, 60 Seconds

+215

°C

Infrared, 15 Seconds

+220

°C

Thermal Resistance: Junction-to-Case

P1 (Q2)

4

°C/W

P2 (Q1)

7

°C/W

P3

4

°C/W

Thermal Resistance: Junction-to-Mounting Surface

35

(1)

°C/W

2.8

(1)

W

Note:

1.

Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 26. Actual results

are dependent on mounting method and surface related to the design.