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74LCX240MTC 数据表(PDF) 1 Page - Fairchild Semiconductor

部件名 74LCX240MTC
功能描述  Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs
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制造商  FAIRCHILD [Fairchild Semiconductor]
网页  http://www.fairchildsemi.com
标志 FAIRCHILD - Fairchild Semiconductor

74LCX240MTC 数据表(HTML) 1 Page - Fairchild Semiconductor

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©1994 Fairchild Semiconductor Corporation
www.fairchildsemi.com
74LCX240 Rev. 1.6.0
January 2008
74LCX240
Low Voltage Octal Buffer/Line Driver with 5V Tolerant
Inputs and Outputs
Features
5V tolerant inputs and outputs
2.3V–3.6V VCC specifications provided
6.5ns tPD max. (VCC = 3.3V), 10µA ICC max.
Power-down high impedance inputs and outputs
Supports live insertion/withdrawal(1)
±24mA output drive (VCC = 3.0V)
Latch-up performance exceeds 500mA
ESD performance:
– Human body model
> 2000V
– Machine model
> 200V
Note:
1. To ensure the high-impedance state during power up
or down, OE should be tied to VCC through a pull-up
resistor: the minimum value or the resistor is
determined by the current-sourcing capability of the
driver.
General Description
The LCX240 is an inverting octal buffer and line driver
designed to be employed as a memory address driver,
clock driver and bus oriented transmitter or receiver. The
device is designed for low voltage (2.5V or 3.3V) VCC
applications with capability of interfacing to a 5V signal
environment.
The LCX240 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
Ordering Information
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
Order
Number
Package
Number
Package Description
74LCX240WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LCX240SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX240MSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LCX240MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Implements proprietary noise/EMI reduction circuitry


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