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UF2007 数据表(PDF) 1 Page - Shenzhen Taychipst Electronic Co., Ltd |
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UF2007 数据表(HTML) 1 Page - Shenzhen Taychipst Electronic Co., Ltd |
1 / 2 page 50V-1000V 2.0 A UF2001 THRU UF2007 ULTRA-FAST RECTIFIER Web Site: www.taychipst.com 1 of 2 FEATURES E-mail: sales@taychipst.com MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Mechanical Data · Diffused Junction · Ultra-Fast Switching for High Efficiency · High Current Capability and Low Forward Voltage Drop · Surge Overload Rating to 60A Peak · Low Reverse Leakage Current · Lead Free Finish, RoHS Compliant (Note 4) · Case: Molded Plastic · Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 · Moisture Sensitivity: Level 1 per J-STD-020C · Terminals: Finish – Bright Tin. Solderable per MIL-STD-202, Method 208 · Polarity: Cathode Band · Marking: Type Number · Mounting Position: Any · Weight: 0.4 grams (approximate) Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Symbol UF 2001 UF 2002 UF 2003 UF 2004 UF 2005 UF 2006 UF 2007 Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 50 100 200 400 600 800 1000 V RMS Reverse Voltage VR(RMS) 35 70 140 280 420 560 700 V Average Rectified Output Current (Note 1) @ TA = 50 °C IO 2.0 A Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave Superimposed on Rated Load (JEDEC Method) IFSM 60 A Forward Voltage @ IF = 2.0A VFM 1.0 1.3 1.7 V Peak Reverse Current @ TA = 25 °C at Rated DC Blocking Voltage @ TA = 100 °C IRM 5.0 100 mA Reverse Recovery Time (Note 3) trr 50 75 ns Typical Junction Capacitance (Note 2) Cj 50 30 pF Typical Thermal Resistance Junction to Ambient RqJA 50 K/W Operating and Storage Temperature Range Tj, TSTG -65 to +150 °C Notes: 1. Valid provided that leads are maintained at ambient temperature at a distance of 9.5mm from the case. 2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC. 3. Measured at IF = 0.5A, IR = 1.0A, Irr = 0.25A. See figure 5. 4. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7. |
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