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CS8182YDPSR5G 数据表(PDF) 7 Page - ON Semiconductor |
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CS8182YDPSR5G 数据表(HTML) 7 Page - ON Semiconductor |
7 / 12 page CS8182 http://onsemi.com 7 External Capacitors The output capacitor for the CS8182 is required for stability. Without it, the regulator output will oscillate. Actual size and type may vary depending upon the application load and temperature range. Capacitor effective series resistance (ESR) is also a factor in the IC stability. Worst−case is determined at the minimum ambient temperature and maximum load expected. The output capacitor can be increased in size to any desired value above the minimum. One possible purpose of this would be to maintain the output voltage during brief conditions of negative input transients that might be characteristic of a particular system. The capacitor must also be rated at all ambient temperatures expected in the system. To maintain regulator stability down to −40 °C, a capacitor rated at that temperature must be used. Calculating Power Dissipation in a Single Output Linear Regulator The maximum power dissipation for a single output regulator (Figure 17) is: PD(max) + {VIN(max) * VOUT(min)} IOUT(max) ) VIN(max)IQ (1) where: VIN(max) is the maximum input voltage, VOUT(min) is the minimum output voltage, IOUT(max) is the maximum output current, for the application,and IQ is the quiescent current the regulator consumes at IOUT(max). Once the value of PD(max) is known, the maximum permissible value of RqJA can be calculated: RqJA + 150° C * TA PD (2) The value of RqJA can then be compared with those in the package section of the data sheet. Those packages with RqJA’s less than the calculated value in equation 2 will keep the die temperature below 150 °C. In some cases, none of the packages will be sufficient to dissipate the heat generated by the IC, and an external heat sink will be required. Figure 17. Single Output Regulator with Key Performance Parameters Labeled IIN IOUT IQ SMART VOUT VIN REGULATOR® Control Features Heatsinks A heatsink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of RqJA: RqJA + RqJC ) RqCS ) RqSA (3) where: RqJC = the junction−to−case thermal resistance, RqCS = the case−to−heatsink thermal resistance, and RqSA = the heatsink−to−ambient thermal resistance. RqJC appears in the package section of the data sheet. Like RqJA, it is a function of package type. RqCS and RqSA are functions of the package type, heatsink and the interface between them. These values appear in heat sink data sheets of heatsink manufacturers. |
类似零件编号 - CS8182YDPSR5G |
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类似说明 - CS8182YDPSR5G |
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