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CXA1315 数据表(PDF) 11 Page - Sony Corporation |
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CXA1315 数据表(HTML) 11 Page - Sony Corporation |
11 / 11 page CXA1315M/P – 11 – CXA1315P PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 19.2 – 0.1 + 0.4 9 18 2.54 0.5 ± 0.1 1.2 ± 0.15 0° to 15° 16 16PIN DIP (PLASTIC) 1.0 g SONY CODE EIAJ CODE JEDEC CODE DIP-16P-01 DIP016-P-0300 Similar to MO-001-AE 1.All mat surface type. Two kinds of package surface: 2.All mirror surface type. SONY CODE EIAJ CODE JEDEC CODE PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY RESIN SOLDER PLATING COPPER DIP-16P-191 DIP016-P-0300-AU MS-001-AA 16PIN DIP (PLASTIC) 300mil 0° to 10° 1 8 9 16 19.35 ± 0.5 2.54 ± 0.254 0.457 ± 0.076 1.016 1.0g |
类似零件编号 - CXA1315 |
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类似说明 - CXA1315 |
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