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Bill of Materials

7

Bill of Materials

Table 2 lists the bill of materials for the TPS826xxEVM.

Table 2. TPS826xxEVM-646 Bill of Materials

EVM Device Option: Count

-001

-002

-003

-004

-005

RefDes

Value

Description

Size

Part Number

Mfr

0

0

0

0

0

C1, C2

Open

Capacitor, Ceramic

0603

Std

Std

Capacitor, Tantalum, 6.3 V, 70 m

Ω,

1

1

1

1

1

C3

150

µF

3528(B)

T520B157M006ATE070

Kemet

20%

Connector, SMA , Straight, PC

0

0

0

0

0

J7

Open

901-144-8RFX

AMP

0.210 in

2

mount

IC, 600-mA, High-Freq

µModule

1

0

0

0

0

U1

TPS82671SIP

SIP-8

TPS82671SIP

TI

Step-Down Converter

IC, 600-mA, High-Freq

µModule

0

1

0

0

0

U1

TPS82675SIP

SIP-8

TPS82675SIP

TI

Step-Down Converter

IC, 500-mA, High-Freq

µModule

0

0

1

0

0

U1

TPS82690SIP

SIP-8

TPS82690SIP

TI

Step-Down Converter

IC, 500-mA, High-Freq

µModule

0

0

0

1

0

U1

TPS82695SIP

SIP-8

TPS82695SIP

TI

Step-Down Converter

IC, 600-mA, High-Freq

µModule

0

0

0

0

1

U1

TPS82672SIP

SIP-8

TPS82672SIP

TI

Step-Down Converter

8

Marking Information

Table 3 provides the marking information for this EVM.

Table 3. Marking Information

Assembly Number

Marking Text

HPA646-001

TPS82671EVM-646

HPA646-002

TPS82675EVM-646

HPA646-003

TPS82690EVM-646

HPA646-004

TPS82695EVM-646

HPA646-005

TPS82672EVM-646

Revision History

•

Added column for -005 option to Table 2

............................................................................................ 11

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

11

SLVU383D

– October 2010 – Revised November 2011

Revision History

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