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SM470R1B1M-HT 数据表(PDF) 3 Page - Texas Instruments |
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SM470R1B1M-HT 数据表(HTML) 3 Page - Texas Instruments |
3 / 67 page SM470R1B1M-HT www.ti.com SPNS155F – SEPTEMBER 2009 – REVISED AUGUST 2012 ORDERING INFORMATION(1) TA PACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING KGD SM470R1B1MKGDS1 SM470R1B1MKGDS1 –55°C to 220°C CQFP-HFQ SM470R1B1MHFQS SM470R1B1MHFQS CQFP-HKP SM470R1B1MHKPS SM470R1B1MHKPS (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. (2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DIE LAYOUT Table 1. Bare Die Information DIE PAD DIE DIE PAD BACKSIDE BACKSIDE DIE SIZE DIE PAD SIZE COORDINATES(1) THICKNESS COMPOSITION FINISH POTENTIAL 208.858 x 211.890 mils/ Silicon with 65.1 x 65.1(µm) See Table 2 11 mils AlCu Ground 5304.99 x 5382.01 µm backgrind (1) Pads 12, 22, 26, 136, 143, 146, 149 and 152 are test pads, no connections required. It is highly recommended to leave them open. Copyright © 2009–2012, Texas Instruments Incorporated Submit Documentation Feedback 3 |
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类似说明 - SM470R1B1M-HT |
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