NUMBER

GS-29-010

TYPE

PRODUCT QUALIFICATION SUMMARY

TITLE

PAGE

REVISION

1 of 10

A

AUTHORIZED BY

DATE

FCI BergStak® Connector & TE Free Height* Connector Inter-Mating

* Free Height™ is a trademark of Tyco Electronics, Inc., All rights reserved.

Matthew Cheong

27

CLASSIFICATION

UNRESTRICTED

© 2009, FCI USA LLC

Form E-3334

Rev F

GS-01-001

1.0

OBJECTIVE

This document summarizes qualification test results and inter-mating performance of BergStak® connectors

and Tyco Free Height Connectors based on the requirements of the FCI BergStak® Product Specification.

These tests were completed by an independent test laboratory contracted by FCI.

2.0

SCOPE

This summary includes results of qualification testing for each FCI/Tyco inter-mating combination.

Connectors in the test plan represent commercially available products. 40 position and 120 position

connectors were used. All connectors mated with a PCB stack height of 5mm. FCI BergStak® Receptacle

and Plug contact interfaces were plated with 30 µ” GXT, while Tyco Receptacle and Plug were plated with 30

µ” Au.

An inter-mating study was performed using the following sequence per revision B of Product Specification

GS-12-547:

•

Group 2, Vibration and Mechanical Shock Sequence

o

FCI Plug mated to Tyco Receptacle (Section 6.1.1)

o

Tyco Plug mated to FCI Receptacle (Section 6.1.2)

•

Group 3, Mating/Un-mating force with Durability Sequence

o

FCI Plug mated to Tyco Receptacle (Section 6.2.1)

o

Tyco Plug mated to FCI Receptacle (Section 6.2.2)

•

Group 7, Thermal Shock, Cyclic Humidity & Temperature Sequence

o

FCI Plug mated to Tyco Receptacle (Section 6.3.1)

o

Tyco Plug mated to FCI Receptacle (Section 6.3.2)

•

Group 8, Temperature Life Sequence

o

FCI Plug mated to Tyco Receptacle (Section 6.4.1)

o

Tyco Plug mated to FCI Receptacle (Section 6.4.2)

3.0

CONCLUSION

The test results indicate that FCI to Tyco inter-mating performance meets the requirement of FCI product

specification, applicable to the full test sequence scope specified in section 2.0.

4.0

DEFINITIONS

EIA:

Electronic Industries Alliance

LLCR:

Low Level Contact Resistance

5.0

REFERENCE DOCUMENTS

5.1

Product Specification GS-12-547, Revision B

5.2

EIA 364 series test procedures

PDM: Rev:A

Released

.

STATUS:

Printed: Nov 28, 2010