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DRV8834RGET Datasheet(数据表) 5 Page - Texas Instruments

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部件型号  DRV8834RGET
说明  DUAL BRIDGE STEPPER OR DC MOTOR DRIVER
下载  30 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
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DRV8834RGET Datasheet(HTML) 5 Page - Texas Instruments

 
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DRV8834
www.ti.com
SLVSB19A – FEBRUARY 2012 – REVISED MARCH 2012
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1) (2)
VALUE
UNIT
VM
Power supply voltage range
–0.3 to 11.8
V
AVREF,
BVREF,
VINT,
Analog input pin voltage range
-0.5 to 3.6
V
ADECAY,
BDECAY
Digital input pin voltage range
–0.5 to 7
V
xISEN pin voltage
–0.3 to 0.5
V
Peak motor drive output current, t < 1 µs
Internally limited
A
TJ
Operating virtual junction temperature range
–40 to 150
°C
Tstg
Storage temperature range
–60 to 150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
THERMAL INFORMATION
PWP
RGE
THERMAL METRIC
UNITS
24 PINS
24 PINS
θJA
Junction-to-ambient thermal resistance(1)
40.2
35.1
θJCtop
Junction-to-case (top) thermal resistance(2)
23.7
36.6
θJB
Junction-to-board thermal resistance(3)
21.9
12.2
°C/W
ψJT
Junction-to-top characterization parameter(4)
0.7
0.6
ψJB
Junction-to-board characterization parameter(5)
21.7
12.2
θJCbot
Junction-to-case (bottom) thermal resistance(6)
3.9
4.0
xxx
(1)
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(2)
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(3)
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(4)
The junction-to-top characterization parameter,
ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining
θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(5)
The junction-to-board characterization parameter,
ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining
θJA , using a procedure described in JESD51-2a (sections 6 and 7).
(6)
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
RECOMMENDED OPERATING CONDITIONS
TA = 25°C, over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VM
Motor power supply voltage range(1)
2.5
10.8
V
VREF
VREF input voltage range(2)
1
2
V
IVINT
VINT external load current
1
mA
IVREF
VREF external load current
400
µA
VDIGIN
Digital input pin voltage range
-0.3
5.75
V
IOUT
Continuous RMS or DC output current per bridge(3)
1.5
A
(1)
Note that RDS(ON) increases and maximum output current is reduced at VM supply voltages below 5 V.
(2)
Operational at VREF between 0 V and 1 V, but accuracy is degraded.
(3)
Power dissipation and thermal limits must be observed.
Copyright © 2012, Texas Instruments Incorporated
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