Package Information

Vishay Siliconix

Document Number: 71151

15-Jan-04

www.vishay.com

1

1206-8 ChipFETR

c

E

e

D

A

65

7

8

34

2

1

4

L

567

8

432

1

4

S

b

2X 0.10/0.13 R

Backside View

x

NOTES:

1.

All dimensions are in millimeaters.

2.

Mold gate burrs shall not exceed 0.13 mm per side.

3.

Leadframe to molded body offset is horizontal and vertical shall not exceed

0.08 mm.

4.

Dimensions exclusive of mold gate burrs.

5.

No mold flash allowed on the top and bottom lead surface.

DETAIL X

MILLIMETERS

INCHES

Dim

Min

Nom

Max

Min

Nom

Max

A

1.00

−

1.10

0.039

−

0.043

b

0.25

0.30

0.35

0.010

0.012

0.014

c

0.1

0.15

0.20

0.004

0.006

0.008

c1

0

−

0.038

0

−

0.0015

D

2.95

3.05

3.10

0.116

0.120

0.122

E

1.825

1.90

1.975

0.072

0.075

0.078

1.55

1.65

1.70

0.061

0.065

0.067

e

0.65 BSC

0.0256 BSC

L

0.28

−

0.42

0.011

−

0.017

S

0.55 BSC

0.022 BSC

5_Nom

5_Nom

ECN: C-03528—Rev. F, 19-Jan-04

DWG: 5547