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DG3535DB-T1-E1 数据表(PDF) 8 Page - Vishay Siliconix |
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DG3535DB-T1-E1 数据表(HTML) 8 Page - Vishay Siliconix |
8 / 9 page www.vishay.com 8 Document Number: 72961 S11-0303-Rev. G, 28-Feb-11 Vishay Siliconix DG3535, DG3536 PACKAGE OUTLINE MICRO FOOT: 10 BUMP (4 x 3, 0.5 mm PITCH, 0.238 mm BUMP HEIGHT) Notes (Unless Otherwise Specified): a. Bump is Lead Free Sn/Ag/Cu. b. Non-solder mask defined copper landing pad. c. Laser Mark on silicon die back; back-lapped, no coating. Shown is not actual marking; sample only. Notes: a. Use millimeters as the primary measurement. Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?72961. Index-Bump A1 Note c Top Side (Die Back) XXX 3535 Recommended Land Pattern 0.5 0.5 Bump Note a 32 1 A B e D A A2 A1 S S E Silicon C 4 b Diameter e e e e 10 X Ø 0.150 0.229 Note b Solder Mask Ø Pad Diameter + 0.1 Millimetersa Inches Dim. Min. Max. Min. Max. A 0.688 0.753 0.0271 0.0296 A1 0.218 0.258 0.0086 0.0102 A2 0.470 0.495 0.0185 0.0195 b 0.306 0.346 0.0120 0.0136 D 1.980 2.020 0.0780 0.0795 E 1.480 1.520 0.0583 0.0598 e 0.5 BASIC 0.0197 BASIC S 0.230 0.270 0.0091 0.0106 |
类似零件编号 - DG3535DB-T1-E1 |
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类似说明 - DG3535DB-T1-E1 |
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