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DRV8302DCAR Datasheet(数据表) 6 Page - Texas Instruments

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部件型号  DRV8302DCAR
说明  Three Phase Pre-Driver with Dual Current Shunt Amplifiers and Buck Regulator Hardware Controlled
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
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DRV8302DCAR Datasheet(HTML) 6 Page - Texas Instruments

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DRV8302
SLES267
– AUGUST 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)
VALUE
UNITS
MIN
MAX
PVDD
Supply voltage range including transient
Relative to PGND
–0.3
70
V
PVDDRAMP
Maximum supply voltage ramp rate
Voltage rising up to PVDDMAX
50
V/mS
VPGND
Maximum voltage between PGND and GND
±0.3
V
IIN_MAX
Maximum current, all digital and analog input pins except FAULT and OCTW pins
±1
mA
IIN_OD_MAX
Maximum sinking current for open drain pins (FAULT and OCTW Pins)
7
mA
VOPA_IN
Voltage range for SPx and SNx pins
±0.6
V
VLOGIC
Input voltage range for logic/digital pins (INH_A, INL_A, INH_B, INL_B, INH_C,
-0.3
7
V
INL_C, EN_GATE, M_PWM, M_OC, OC_ADJ, GAIN, DC_CAL)
VGVDD
Maximum voltage for GVDD Pin
13.2
V
VAVDD
Maximum voltage for AVDD Pin
8
V
VDVDD
Maximum voltage for DVDD Pin
3.6
V
VREF
Maximum reference voltage for current amplifier
7
V
IREF
Maximum current for REF Pin
100
µA
TJ
Maximum operating junction temperature range
–40
150
°C
TSTORAGE
Storage temperature range
–55
150
°C
Capacitive discharge model
500
V
Human body model
2000
V
(1)
Stresses beyond those listed under
“absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
“recommended operating
conditions
” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
DRV8302
THERMAL METRIC(1)
DCA
UNITS
(56) PINS
θJA
Junction-to-ambient thermal resistance
30.3
θJCtop
Junction-to-case (top) thermal resistance
33.5
θJB
Junction-to-board thermal resistance
17.5
°C/W
ψJT
Junction-to-top characterization parameter
0.9
ψJB
Junction-to-board characterization parameter
7.2
θJCbot
Junction-to-case (bottom) thermal resistance
0.9
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6
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Copyright
© 2011, Texas Instruments Incorporated
Product Folder Link(s): DRV8302




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