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SD-45593-001 数据表(PDF) 7 Page - Molex Electronics Ltd. |
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SD-45593-001 数据表(HTML) 7 Page - Molex Electronics Ltd. |
7 / 26 page HANDYLINK™ APPLICATION SPECIFICATION REVISION: ECR/ECN INFORMATION: SHEET No. EC No: UCP2006-2962 A1 DATE: 2006/08/07 TITLE: APPLICATION SPECIFICATION HANDYLINK™I/O CONNECTOR SYSTEM 7 of 26 DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: APPROVED BY: SD-45593-001 Marc Simmel Marc Simmel Joe Comerci TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC 4.3 Clearances Between Mated Parts The HandyLink connectors are designed such that the corresponding ‘front’ faces fully engage and then spring back 0.20mm to the final mated condition. This ‘over-travel clearance’ assures that the components of the passive latching system engage. Please see Section 6.4 Design Best Practices for further detailed information. 5.0 SOLDERING PROCESS RECOMMENDATIONS 5.1 44828 SMT Receptacle Connector 5.1.1 PCB Layout See the applicable Sales Drawing for an illustration of the recommended PCB layout. Contact Molex if further assistance is required. 5.1.2 Solder Paste Stencil Layout See Sales Drawing for solderable surfaces. Contact Molex if further assistance is required. 5.1.3 Reflow Profile While the production solder reflow profile is typically established by the customer, based on their specific application, generic reflow profiles can be found in Product Specification PS-44828-001. The profiles are provided for reference purposes only. 5.1.4 Inspection Solder joints should be inspected using established conventional methods. 5.2 45560 SMT Cradle Connector 5.2.1 PCB Layout See the applicable Sales Drawings for illustrations of the recommended PCB pad layouts. Contact Molex if further assistance is required. 5.2.2 Solder Paste Stencil Layout See Sales Drawing for recommended PCB pad layout and solder paste thickness. |
类似零件编号 - SD-45593-001 |
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类似说明 - SD-45593-001 |
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