HANDYLINK™

APPLICATION SPECIFICATION

REVISION:

ECR/ECN INFORMATION:

SHEET No.

EC No:

UCP2006-2962

A1

DATE:

2006/08/07

TITLE:

APPLICATION SPECIFICATION

HANDYLINK™I/O CONNECTOR SYSTEM

7 of 26

DOCUMENT NUMBER:

CREATED / REVISED BY:

CHECKED BY:

APPROVED BY:

SD-45593-001

Marc Simmel

Marc Simmel

Joe Comerci

TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC

4.3

Clearances Between Mated Parts

The HandyLink connectors are designed such that the corresponding ‘front’ faces fully engage and then spring back 0.20mm to the

final mated condition. This ‘over-travel clearance’ assures that the components of the passive latching system engage. Please see

Section 6.4 Design Best Practices for further detailed information.

5.0 SOLDERING PROCESS RECOMMENDATIONS

5.1 44828 SMT Receptacle Connector

5.1.1

PCB Layout

See the applicable Sales Drawing for an illustration of the recommended PCB layout. Contact Molex if further assistance is required.

5.1.2

Solder Paste Stencil Layout

See Sales Drawing for solderable surfaces. Contact Molex if further assistance is required.

5.1.3

Reflow Profile

While the production solder reflow profile is typically established by the customer, based on their specific application, generic reflow

profiles can be found in Product Specification PS-44828-001. The profiles are provided for reference purposes only.

5.1.4

Inspection

Solder joints should be inspected using established conventional methods.

5.2 45560 SMT Cradle Connector

5.2.1

PCB Layout

See the applicable Sales Drawings for illustrations of the recommended PCB pad layouts. Contact Molex if further assistance is

required.

5.2.2

Solder Paste Stencil Layout

See Sales Drawing for recommended PCB pad layout and solder paste thickness.