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ISL21007 数据表(PDF) 2 Page - Intersil Corporation

部件名 ISL21007
功能描述  Precision, Low Noise FGA??Voltage References
Download  20 Pages
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制造商  INTERSIL [Intersil Corporation]
网页  http://www.intersil.com/cda/home
标志 INTERSIL - Intersil Corporation

ISL21007 数据表(HTML) 2 Page - Intersil Corporation

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ISL21007
2
FN6326.8
July 14, 2011
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
VOUT OPTION
(V)
GRADE
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
PKG. DWG. #
ISL21007BFB812Z
21007BF Z12
1.250
±0.5mV, 3ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007CFB812Z
21007CF Z12
1.250
±1.0mV, 5ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007DFB812Z
21007DF Z12
1.250
±2.0mV, 10ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007BFB820Z
21007BF Z20
2.048
±0.5mV, 3ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007CFB820Z
21007CF Z20
2.048
±1.0mV, 5ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007DFB820Z
21007DF Z20
2.048
±2.0mV, 10ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007BFB825Z
21007BF Z25
2.500
±0.5mV, 3ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007CFB825Z
21007CF Z25
2.500
±1.0mV, 5ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007DFB825Z
21007DF Z25
2.500
±2.0mV, 10ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007BFB830Z
21007BF Z30
3.000
±0.5mV, 3ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007CFB830Z
21007CF Z30
3.000
±1.0mV, 5ppm/°C
-40 to +125
8 Ld SOIC
M8.15
ISL21007DFB830Z
21007DF Z30
3.000
±2.0mV, 10ppm/°C
-40 to +125
8 Ld SOIC
M8.15
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin
plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL21007. For more information on MSL please see techbrief TB363.


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