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STK400-480 数据表(PDF) 4 Page - Sanyo Semicon Device |
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STK400-480 数据表(HTML) 4 Page - Sanyo Semicon Device |
4 / 6 page STK400-030 No. 5703—4/6 Heatsink Design Considerations The heatsink thermal resistance, θc-a, required to cover the hybrid IC’s total power dissipation, Pd, is determined as follows: Condition 1: Hybrid IC’s substrate temperature not to exceed 125 °C. Pd × θc-a + Ta < 125°C ........................................ (1) where Ta is the guaranteed maximum ambient tempera- ture. Condition 2: Power transistor junction temperature, Tj, not to exceed 150 °C. Pd × θc-a + Pd/N × θj-c + Ta < 150°C ................. (2) where N is the number of power transistors and θj-c is the thermal resistance per power transistor. Note that the power dissipated per transistor is the total, Pd, divided evenly among the N power transistors. Expressions (1) and (2) can be rewritten making θc-a the subject. θc-a < (125 − Ta)/Pd............................................. (1)′ θc-a < (150 − Ta)/Pd − θj-c/N .............................. (2)′ The heatsink required must have a thermal resistance that simultaneously satisfies both expressions. The heatsink thermal resistance can be determined from (1) ′ and (2)′ once the following parameters have been defined. • Supply voltage : VCC • Load resistance : RL • Guaranteed maximum ambient temperature : Ta The total device power dissipation when hybrid IC’s VCC = ±23V and R L = 6Ω, for a continuous sine wave signal, is a maximum of 55W, as is in Pd-PO graph. When estimating the power dissipation for an actual audio signal input, the rule of thumb is to select Pd correspond- ing to 1/10 PO max (within safe limits) for a continuous sine wave input. For example, Pd = 31W (for 1/10 PO max = 2W) The hybrid IC has 6 power transistors, and the thermal resistance per transistor, θj-c, is 2.1°C/W. If the guaran- teed maximum ambient temperature, Ta, is 50 °C, then the required heatsink thermal resistance, θc-a, is: From expression (1) ′: θc-a < (125 − 50)/31 < 2.41 From expression (2) ′: θc-a < (150 − 50)/31 − 2.1/6 < 2.87 Therefore, to satisfy both expressions, the required heat- sink must have a thermal resistance less than 2.41 °C/W. Similarly, when hybrid IC’s VCC = ±19V and RL = 3Ω: Pd = 36W (for 1/10 PO max = 2W) From expression (1) ′: θc-a < (125 − 50)/36 < 2.08 From expression (2) ′: θc-a < (150 − 50)/36 − 2.1/6 < 2.42 Therefore, to satisfy both expressions, the required heat- sink must have a thermal resistance less than 2.08 °C/W. This heatsink design example is based on a constant-volt- age egulated power supply, and should be verified within your specific set environment. Output power per channel, PO /ch - W Output power per channel, PO /ch - W |
类似零件编号 - STK400-480 |
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类似说明 - STK400-480 |
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