© 2007 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN2564 • Rev. 1.0.2

11

Physical Dimensions

BOTTOM VIEW

SIDE VIEWS

TOP VIEW

RECOMMENDED LAND PATTERN

(NSMD PAD TYPE)

NOTES:

A. NO JEDEC REGISTRATION APPLIES.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

D. DATUM C IS DEFINED BY THE SPHERICAL

CROWNS OF THE BALLS.

E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS

±43 MICRONS (539-625 MICRONS).

F. FOR DIMENSIONS D, E, X, AND Y SEE

PRODUCT DATASHEET.

G. DRAWING FILENAME: MKT-UC004ABrev2.

2X

PIN A1 AREA

0.03 C

E

D

A

B

2X

0.03 C

0.05 C

0.625

0.539

C

0.332±0.018

0.250±0.025

SEATING PLANE

D

F

F

0.06 C

1 2

A

B

0.005

CA B

0.50

0.50

Ø0.315±0.025

4X

(Y)±0.018

(X)±0.018

(Ø0.250)

Cu Pad

(Ø0.350)

Solder Mask

0.50

0.50

Figure 26.

4-Bump, Wafer-Level Chip-Scale Package (WLCSP), 0.5mm Pitch

Product Specific Dimensions

Product

D

E

X

Y

FAN2564UCX

1.41 +/-0.030

0.93 +/-0.030

0.215

0.455

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cifically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: