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ZXMP6A17N8 数据表(PDF) 2 Page - Diodes Incorporated

部件名 ZXMP6A17N8
功能描述  60V P-CHANNEL ENHANCEMENT MODE MOSFET
Download  8 Pages
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制造商  DIODES [Diodes Incorporated]
网页  http://www.diodes.com
标志 DIODES - Diodes Incorporated

ZXMP6A17N8 数据表(HTML) 2 Page - Diodes Incorporated

  ZXMP6A17N8 Datasheet HTML 1Page - Diodes Incorporated ZXMP6A17N8 Datasheet HTML 2Page - Diodes Incorporated ZXMP6A17N8 Datasheet HTML 3Page - Diodes Incorporated ZXMP6A17N8 Datasheet HTML 4Page - Diodes Incorporated ZXMP6A17N8 Datasheet HTML 5Page - Diodes Incorporated ZXMP6A17N8 Datasheet HTML 6Page - Diodes Incorporated ZXMP6A17N8 Datasheet HTML 7Page - Diodes Incorporated ZXMP6A17N8 Datasheet HTML 8Page - Diodes Incorporated  
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ZXMP6A17N8
Document Number DS32076 Rev 1 - 2
2 of 8
www.diodes.com
March 2010
© Diodes Incorporated
A Product Line of
Diodes Incorporated
ZXMP6A17N8
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Drain-Source voltage
VDSS
-60
V
Gate-Source voltage
VGS
±20
V
Continuous Drain current
VGS = 10V
(Note 3)
ID
-3.42
A
TA = 70°C (Note 3)
-2.73
(Note 2)
-2.7
Pulsed Drain current
VGS = 10V
(Note 4)
IDM
-15.6
A
Continuous Source current (Body diode)
(Note 3)
IS
-3.4
A
Pulsed Source current (Body diode)
(Note 4)
ISM
-15.6
A
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Power dissipation
Linear derating factor
(Note 2)
PD
1.56
12.5
W
mW/
°C
(Note 3)
2.5
20
Thermal Resistance, Junction to Ambient
(Note 2)
RθJA
80
°C/W
(Note 3)
50
Thermal Resistance, Junction to Lead
(Note 5)
RθJL
32
Operating and storage temperature range
TJ, TSTG
-55 to 150
°C
Notes:
2. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
3. Same as note (2), except the device is measured at t
≤ 10 sec.
4. Same as note (2), except the device is pulsed with D= 0.02 and pulse width 300 µs. The pulse current is limited by the maximum junction temperature.
5. Thermal resistance from junction to solder-point (at the end of the drain lead).


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