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AD8231-EVALZ 数据表(PDF) 7 Page - Analog Devices |
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AD8231-EVALZ 数据表(HTML) 7 Page - Analog Devices |
7 / 24 page AD8231 Rev. A | Page 7 of 24 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 4. Parameter Rating Table 5. Supply Voltage 6 V Thermal Pad θ Unit JA Output Short-Circuit Current Indefinite1 Soldered to Board 54 °C/W Input Voltage (Common-Mode) −VS − 0.3 V to +VS + 0.3 V Not Soldered to Board 96 °C/W Differential Input Voltage −VS − 0.3 V to +VS + 0.3 V The θ values in Table 5 Storage Temperature Range –65°C to +150°C JA assume a 4-layer JEDEC standard board. If the thermal pad is soldered to the board, it is also assumed it is connected to a plane. θ Operational Temperature Range –40°C to +125°C Package Glass Transition Temperature 130°C JC at the exposed pad is 6.3°C/W. ESD (Human Body Model) 1.5 kV MAXIMUM POWER DISSIPATION ESD (Charged Device Model) 1.5 kV ESD (Machine Model) 0.2 kV The maximum safe power dissipation for the AD8231 is limited by the associated rise in junction temperature (T 1 For junction temperatures between 105°C and 130°C, short-circuit operation beyond 1000 hours can impact part reliability. J ) on the die. At approximately 130°C, which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit may change the stresses that the package exerts on the die, permanently shifting the parametric perform- ance of the amplifiers. Exceeding a temperature of 130°C for an extended period can result in a loss of functionality. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION |
类似零件编号 - AD8231-EVALZ |
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类似说明 - AD8231-EVALZ |
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