POWER RECTIFIER DIODE

1N5550D3A / 1N5550D3B

Semelab plc

Semelab plc

Semelab plc

Semelab plc

Coventry Road, Lutterworth, Leicestershire, LE17 4JB

Document Number 8814

Telephone +44 (0) 1455 556565

Fax +44 (0) 1455 552612

Issue 2

Page 3 of 4

MECHANICAL DATA

A

D

C

C

1

2

SML

D3A

A

D

C

C

1

2

3

SML

D3B

* The additional contact provides a connection to the lid in the application. Connecting the metal lid to a known electrical potential stops deep

to be specified at order.

†

The DLCC3 package design takes full advantage of the proven high reliability pedigree of the HTCC surface mount packaging technology,

which is easily integrated for automated assembly. Semelab has taken the existing standards for ceramic surface mount package manufacture

and added additional design features to enhance thermal performance, to present a competitive alternative for high reliability applications.

SOLDER PAD LAYOUT

)

*

Soldering temperature should be 260°C for a

maximum of 10 seconds.

The physical dimensions for the DLCC3 ceramic package are designed

to be different from the published dimensions for the “D-5B” and “E-

MELF” outlines.

The DLCC3 design fully utilises the recommended

solder footprint for the “D-5B” / “E-MELF” Package, and as such

presents a drop in replacement for existing board designs.

PACKAGE MASS

Gold Plated Solder Pad Finish = 150mg

mm

Inches

A

7.32

0.288

B

1.78

0.070

C

3.94

0.155

DLCC3 Variant B (D3B)

PAD 1

ANODE

PAD 2

CATHODE

PAD 3

LID CONTACT TO CATHODE*

DIMENSION

mm

Inches

A

7.00 ±0.10

0.275 ±0.004

B

3.75 ±0.10

0.143 ±0.004

C

1.60 ±0.10

0.063 ±0.004

D

1.76 ±0.10

0.069 ±0.004

DLCC3 Variant A (D3A)

PAD 1

ANODE

PAD 2

CATHODE

DIMENSION

mm

Inches

A

7.00 ±0.10

0.275 ±0.004

B

3.75 ±0.10

0.143 ±0.004

C

1.60 ±0.10

0.063 ±0.004

D

1.76 ±0.10

0.069 ±0.004