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TJA1021T 数据表(PDF) 21 Page - NXP Semiconductors |
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TJA1021T 数据表(HTML) 21 Page - NXP Semiconductors |
21 / 25 page TJA1021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 6 — 30 December 2010 21 of 25 NXP Semiconductors TJA1021 LIN 2.1/SAE J2602 transceiver For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 17. Soldering of HVSON packages Section 16 contains a brief introduction to the techniques most commonly used to solder Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON leadless package ICs can found in the following application notes: • AN10365 ‘Surface mount reflow soldering description” • AN10366 “HVQFN application information” MSL: Moisture Sensitivity Level Fig 10. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature |
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