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ISL33003IRTZ 数据表(PDF) 3 Page - Intersil Corporation

部件名 ISL33003IRTZ
功能描述  I2C Bus Buffer with Rise Time Accelerators and Hot Swap Capability
Download  19 Pages
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制造商  INTERSIL [Intersil Corporation]
网页  http://www.intersil.com/cda/home
标志 INTERSIL - Intersil Corporation

ISL33003IRTZ 数据表(HTML) 3 Page - Intersil Corporation

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3
FN7560.2
September 30, 2010
ISL33002
(8 LD TDFN)
TOP VIEW
ISL33002
(8 LD MSOP)
TOP VIEW
ISL33003
(8 LD TDFN)
TOP VIEW
ISL33003
(8 LD MSOP)
TOP VIEW
Pin Descriptions
NAME
NOTES
PIN NUMBER
FUNCTION
VCC1
8VCC1 power supply, +2.3V to +5.5V. Decouple VCC1 to ground with a high
frequency 0.01µF to 0.1µF capacitor.
VCC2
ISL33002, ISL33003
1
VCC2 power supply, +2.3V to +5.5V. Decouple VCC2 to ground with a high
frequency 0.01µF to 0.1µF capacitor. In level shifting applications, SDA_OUT
and SCL_OUT logic thresholds are referenced to VCC2 supply levels. Connect
pull-up resistors on these pins to VCC2.
GND
4
Device Ground Pin
EN
ISL33001
1
Buffer Enable Pin. Logic “0” disables the device. Logic “1” enables the
device. Logic threshold referenced to VCC1.
ISL33003
5
READY
ISL33001 only
5
Buffer Active ‘Ready’ Logic Output. When buffer is active, READY is high
impedance. When buffer is inactive, READY is low impedance to ground.
ACC
ISL33002 only
5
Rise Time Accelerator Enable Pin. Logic “0” disables the accelerator. Logic
“1” enables the accelerator. Logic threshold referenced to VCC1.
SDA_IN
6
Data I/O Pins
SDA_OUT
7
SCL_IN
3
Clock I/O Pins
SCL_OUT
2
PAD
Thermal Pad; TDFN only
Thermal pad should be connected to ground or float.
Pin Configurations (Continued)
3
2
1
GND 4
6
7
8
5
VCC1
ACC
PAD
VCC2
SCL_IN
SCL_OUT
SDA_IN
SDA_OUT
6
7
8
5
3
2
1
4
VCC2
GND
VCC1
ACC
SDA_IN
SDA_OUT
SCL_IN
SCL_OUT
3
2
1
GND 4
6
7
8
5
VCC1
EN
PAD
VCC2
SCL_IN
SCL_OUT
SDA_IN
SDA_OUT
6
7
8
5
3
2
1
4
VCC2
GND
VCC1
EN
SCL_IN
SCL_OUT
SDA_IN
SDA_OUT
ISL33001, ISL33002, ISL33003


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