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TEA3718DP 数据表(PDF) 8 Page - STMicroelectronics |
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TEA3718DP 数据表(HTML) 8 Page - STMicroelectronics |
8 / 26 page Electrical specifications 8/26 3.3 Thermal data Figure 5. Maximum power dissipation Figure 6. Typical external component configuration Table 6. Thermal data Symbol Parameters SO20 Power DIP Multiwatt 15 Unit Rth(j-c) Maximum junction-case thermal resistance 16 11 3 oC/W Rth(j-a) Maximum junction-ambient thermal resistance 60(1) 45(1) 40 oC/W 1. Soldered on a 35 µm thick 4 cm2 PC board copper area RS = 1 ohm inductance free RC = 470 ohms CC = 820 pF ceramic Rt = 56 kohms Ct = 820 pF ceramic P = 500 ohms R2 = 1 kohm |
类似零件编号 - TEA3718DP |
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类似说明 - TEA3718DP |
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