SL3S1203_1213_SDS

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2010. All rights reserved.

Product short data sheet

PUBLIC

Rev. 3.2 — 9 November 2010

198732

3 of 22

NXP Semiconductors

SL3S1203_1213

UCODE G2iL and G2iL+

3.

Applications

3.1 Markets

Fashion (Apparel and footwear)

Retail

Electronics

Fast Moving Consumer Goods

Asset management

Electronic Vehicle Identification

3.2 Applications

Supply chain management

Item level tagging

Pallet and case tracking

Container identification

Product authentication

PCB tagging

Cost efficient, low level seals

Wireless firmware download

Wireless product activation

4.

Quick reference data

[1]

5.

Ordering information

Table 1.

Quick reference data

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

EEPROM characteristics

retention time

-

-

year

write endurance

1000

10000[1]

-

cycle

Table 2.

Ordering information

Type number

Package

Name

Description

Version

SL3S1203FUF

Wafer

bumped G2iL die on sawn 8” wafer

not applicable

SL3S1213FUF

Wafer

bumped G2iL+ die on sawn 8” wafer

not applicable

SL3S1203FTB0

XSON6

G2iL, plastic extremely thin small outline

package; no leads; 6 terminals; body 1 x

1.45 x 0.5 mm

SOT886F1

SL3S1213FTB0

XSON6

G2iL+, plastic extremely thin small

outline package; no leads; 6 terminals;

body 1 x 1.45 x 0.5 mm

SOT886F1