3

FN6426.0

May 24, 2007

Pin Descriptions

TSSOP PIN

QFN PIN

SYMBOL

DESCRIPTION

1

19

RH3

“High” terminal of DCP3

2

20

RL3

“Low” terminal of DCP3

3

1

RW3

“Wiper” terminal of DCP3

4

2

NC

No connection

5

3

SCK

SPI interface clock input

6

4

SDO

Data Output of the SPI serial interface

7

5

GND

Device ground pin

8

6

RW2

“Wiper” terminal of DCP2

9

7

RL2

“Low” terminal of DCP2

10

8

RH2

“High” terminal of DCP2

11

9

RW1

“Wiper” terminal of DCP1

12

10

RL1

“Low” terminal of DCP1

13

11

RH1

“High” terminal of DCP1

14

12

CS

Chip Select active low input

15

13

SDI

Data Input of the SPI serial interface

16

14

VCC

Positive power supply pin

17

15

V-

Negative power supply pin

18

16

RH0

“High” terminal of DCP0

19

17

RL0

“Low” terminal of DCP0

20

18

RW0

“Wiper” terminal of DCP0

EPAD*

Exposed Die Pad internally connected to V-

* Note: PCB thermal land for QFN EPAD should be connected to V- plane or left floating. For more information refer to

http://www.intersil.com/data/tb/TB389.pdf

ISL22444