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ADP8870 数据表(PDF) 2 Page - Analog Devices |
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ADP8870 数据表(HTML) 2 Page - Analog Devices |
2 / 2 page ADP8870 Rev. Sp0 | Page 2 of 2 OUTLINE DIMENSIONS A B C D E 2.395 2.355 2.315 2.190 2.150 2.110 1 2 3 4 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) BALL 1 IDENTIFIER 0.40 REF 0.645 0.600 0.555 SIDE VIEW 0.230 0.200 0.170 0.287 0.267 0.247 1.60 REF 1.20 REF COPLANARITY 0.05 SEATING PLANE 0.415 0.400 0.385 Figure 2. 20-Ball Wafer Level Chip Scale Package [WLCSP] (CB-20-7) Dimensions shown in millimeters 0.50 BSC 0.50 0.40 0.30 0.30 0.25 0.20 COMPLIANT TO JEDEC STANDARDS MO-220-WGGD. BOTTOM VIEW TOP VIEW EXPOSED PAD PIN 1 INDICATOR 4.10 4.00 SQ 3.90 SEATING PLANE 0.80 0.75 0.70 0.05 MAX 0.02 NOM 0.20 REF 0.25 MIN COPLANARITY 0.08 PIN 1 INDICATOR 2.65 2.50 SQ 2.35 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 1 20 6 10 11 15 16 5 Figure 3. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 4 mm × 4 mm Body, Very Very Thin Quad (CP-20-10) Dimensions shown in millimeters Figure 4. Tape and Reel Orientation for WLCSP Units Figure 5. Tape and Reel Orientation for LFCSP Units ©2010 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D08829F-0-6/10(Sp0) |
类似零件编号 - ADP8870 |
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类似说明 - ADP8870 |
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