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DAC1408D650_1008 数据表(PDF) 2 Page - NXP Semiconductors |
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DAC1408D650_1008 数据表(HTML) 2 Page - NXP Semiconductors |
2 / 98 page DAC1408D650 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Preliminary data sheet Rev. 02 — 11 August 2010 2 of 98 NXP Semiconductors DAC1408D650 DAC1408D; up to 650 Msps; 2 ×, 4× or 8× interpolating with JESD204A 3. Applications Wireless infrastructure: LTE, WiMAX, GSM, CDMA, WCDMA, TD-SCDMA Communication: LMDS/MMDS, point to point Direct Digital Synthesis (DDS) Broadband wireless systems Digital radio links Instrumentation Automated Test Equipment (ATE) 4. Ordering information Two’s complement or binary offset data format Fully compatible SPI port LMF = 421 or LMF = 211 support Industrial temperature range from −40 °Cto+85 °C Differential CML receiver with embedded termination Integrated PLL can be bypassed Synchronization of multiple DAC devices outputs Embedded complex modulator Table 1. Ordering information Type number Package Name Description Version DAC1408D650HN/C1 HVQFN64 plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 × 9 × 0.85 mm; exposed die pad SOT804-3 |
类似零件编号 - DAC1408D650_1008 |
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类似说明 - DAC1408D650_1008 |
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