www.ti.com

FEATURES

1

2

3

4

5

6

1Y

V

CC

2Y

2A

GND

1A

DBVPACKAGE

(TOP VIEW)

1

2

3

4

5

6

1Y

V

CC

2Y

2A

GND

1A

DCKPACKAGE

(TOP VIEW)

1

2

3

4

5

6

1Y

V

CC

2Y

2A

GND

1A

DRLPACKAGE

(TOP VIEW)

1

2

3

4

5

6

1Y

V

CC

2Y

2A

GND

1A

YZPPACKAGE

(BOTTOM VIEW)

DESCRIPTION/ORDERING INFORMATION

SN74AUC2G34

DUAL BUFFER GATE

SCES514B – NOVEMBER 2003 – REVISED JANUARY 2007

• Available in the Texas Instruments

• Low Power Consumption, 10 µA at 1.8 V

NanoFree™ Package

• ±8-mA Output Drive at 1.8 V

• Optimized for 1.8-V Operation and Is 3.6-V I/O

• Latch-Up Performance Exceeds 100 mA Per

Tolerant to Support Mixed-Mode Signal

JESD 78, Class II

Operation

• ESD Protection Exceeds JESD 22

• I

–

2000-V Human-Body Model (A114-A)

Operation

–

200-V Machine Model (A115-A)

• Sub-1-V Operable

–

1000-V Charged-Device Model (C101)

• Max t

operation.

The SN74AUC2G34 performs the Boolean function Y = A in positive logic.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

Reel of 3000

SN74AUC2G34YZPR

_ _ _U9_

0.23-mm Large Bump – YZP (Pb-free)

SOT-563 – DRL

Reel of 4000

SN74AUC2G34DRLR

U9_

–40°C to 85°C

SOT-23 – DBV

Reel of 3000

SN74AUC2G34DBVR

U34_

SC-70 – DCK

Reel of 3000

SN74AUC2G34DCKR

U9_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2003–2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.