AD9265BCPZRL7-105 datasheet(10/44 Pages) AD

部件名	AD9265BCPZRL7-105

功能描述	16-Bit, 125 MSPS/105 MSPS/80 MSPS 1.8 V Analog-to-Digital Converter

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制造商	AD [Analog Devices]

网页	http://www.analog.com

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AD9265

Rev. A | Page 10 of 44

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

Electrical

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to AGND

−0.3 V to +2.0V

SVDD to AGND

−0.3 V to +3.6 V

VIN+, VIN− to AGND

−0.3 V to AVDD + 0.2 V

CLK+, CLK− to AGND

−0.3 V to AVDD + 0.2 V

SYNC to AGND

−0.3 V to AVDD + 0.2 V

VREF to AGND

−0.3 V to AVDD + 0.2 V

SENSE to AGND

−0.3 V to AVDD + 0.2 V

VCM to AGND

−0.3 V to AVDD + 0.2 V

RBIAS to AGND

−0.3 V to AVDD + 0.2 V

CSB to AGND

−0.3 V to SVDD +0.3 V

SCLK/DFS to AGND

−0.3 V to SVDD +0.3 V

SDIO/DCS to AGND

−0.3V to SVDD + 0.3 V

OEB to AGND

−0.3 V to DRVDD + 0.2 V

PDWN to AGND

−0.3 V to DRVDD + 0.2 V

LVDS to AGND

−0.3 V to AVDD + 0.2 V

LVDS_RS to AGND

−0.3 V to AVDD + 0.2 V

DITHER to AGND

−0.3 V to AVDD + 0.2 V

D0 through D15 to AGND

−0.3 V to DRVDD + 0.2 V

DCO to AGND

−0.3 V to DRVDD + 0.2 V

Environmental

Operating Temperature Range

(Ambient)

−40°C to +85°C

Maximum Junction Temperature

Under Bias

150°C

Storage Temperature Range

(Ambient)

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL CHARACTERISTICS

The exposed paddle must be soldered to the ground plane for

the LFCSP package. Soldering the exposed paddle to the customer

board increases the reliability of the solder joints and maximizes

the thermal capability of the package.

Typical θJA is specified for a 4-layer PCB with a solid ground

plane. As shown, airflow improves heat dissipation, which

reduces θJA. In addition, metal in direct contact with the package

leads from metal traces, through holes, ground, and power

planes, reduces the θJA.

Table 7. Thermal Resistance

Package Type

Airflow

Velocity

(m/s)

θJA1,2

θJC1,3

θJB1,4

Unit

48-Lead LFCSP

(CP-48-8)

0

24.5

1.3

12.7

°C/W

1.0

21.4

°C/W

2.5

19.2

°C/W

1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3 Per MIL-Std 883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

ESD CAUTION

类似零件编号 - AD9265BCPZRL7-105

制造商	部件名	数据表	功能描述
Analog Devices	AD9265BCPZRL7-105	1Mb / 45P	16-Bit, 125 MSPS/105 MSPS/80 MSPS, 1.8 V Analog-to-Digital Converter

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类似说明 - AD9265BCPZRL7-105

制造商	部件名	数据表	功能描述
Analog Devices	AD9265	1Mb / 45P	16-Bit, 125 MSPS/105 MSPS/80 MSPS, 1.8 V Analog-to-Digital Converter
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AD9265BCPZRL7-105 数据表(PDF) 10 Page - Analog Devices

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类似零件编号 - AD9265BCPZRL7-105

类似说明 - AD9265BCPZRL7-105

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