Rev 1.0 / Jan. 2007
4
11
512Mbit (16Mx32bit) Mobile SDR Memory
HY5S7B2LF(P) Series
INFORMATION for Hynix KNOWN GOOD DIE
With the advent of Mullti-Chip package (MCPs), Package on Package (PoP) and system in a package (SiP) applications,
customer demand for Known Good Die (KGD) has increased.
Requirements for smaller form factors and higher memory densities are fueling the need for Wafer-level memory solu-
tions due to their superior flexibility. Hynix Known Good Die (KGD) products can be used in packaging technologies
such as systems-in-a-package (SIPs) and multi-chip packages (MCPs) to reduce the board area required, making them
ideal for handheld PCs, and many other portable digital applications.
Hynix Mobile DRAM will be able to containue its constant effort of enabling the Advanced package products of all appli-
cation customers.
- Please Contact Hynix Office for Hynix KGD product availability and informations.
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