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H57V2582GTR-75I 数据表(PDF) 3 Page - Hynix Semiconductor

部件名 H57V2582GTR-75I
功能描述  256Mb Synchronous DRAM based on 8M x 4Bank x8 I/O
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制造商  HYNIX [Hynix Semiconductor]
网页  http://www.skhynix.com/kor/main.do
标志 HYNIX - Hynix Semiconductor

H57V2582GTR-75I 数据表(HTML) 3 Page - Hynix Semiconductor

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Synchronous DRAM Memory 256Mbit
H57V2582GTR-xxI Series
Rev 1.0 / Aug. 2009
3
DESCRIPTION
The Hynix H57V2582GTR Synchronous DRAM is 268,435,456bit CMOS Synchronous DRAM, ideally suited for the con-
sumer memory applications which requires large memory density and high bandwidth. It is organized as 4banks of
8,388,608 x 8 I/O.
Synchronous DRAM is a type of DRAM which operates in synchronization with input clock. The Hynix Synchronous
DRAM latch each control signal at the rising edge of a basic input clock (CLK) and input/output data in synchronization
with the input clock (CLK). The address lines are multiplexed with the Data Input/ Output signals on a multiplexed x8
Input/ Output bus. All the commands are latched in synchronization with the rising edge of CLK.
The Synchronous DRAM provides for programmable read or write Burst length of Programmable burst lengths: 1, 2, 4,
8 locations or full page. An AUTO PRECHARGE function may be enabled to provide a self-timed row precharge that is
initiated at the end of the burst access. The Synchronous DRAM uses an internal pipelined architecture to achieve
high-speed operation. This architecture is compartible with the 2n rule of prefetch architectures, but it also allows the
column address to be changed on every clock cycle to achieve a high-speed, fully random access. Precharging one
bank while accessing one of the other three banks will hide the precharge cycles and provide seamless, high-speed,
randon-access operation.
Read and write accesses to the Hynix Synchronous DRAM are burst oriented;
accesses start at a selected location and continue for a programmed number of locations in a programmed sequence.
Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command.
The address bits registered coincident with the ACTIVE command are used to select the bank and the row to be
accessed. The address bits registered coincident with the READ or WRITE command are used to select the bank and
the starting column location for the burst access.
All inputs are LVTTL compatible. Devices will have a VDD and VDDQ supply of 3.3V (nominal).


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