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H55S1G62MFP-A3 数据表(PDF) 4 Page - Hynix Semiconductor

部件名 H55S1G62MFP-A3
功能描述  1Gb (64Mx16bit) Mobile SDRAM
Download  53 Pages
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制造商  HYNIX [Hynix Semiconductor]
网页  http://www.skhynix.com/kor/main.do
标志 HYNIX - Hynix Semiconductor

H55S1G62MFP-A3 数据表(HTML) 4 Page - Hynix Semiconductor

  H55S1G62MFP-A3 Datasheet HTML 1Page - Hynix Semiconductor H55S1G62MFP-A3 Datasheet HTML 2Page - Hynix Semiconductor H55S1G62MFP-A3 Datasheet HTML 3Page - Hynix Semiconductor H55S1G62MFP-A3 Datasheet HTML 4Page - Hynix Semiconductor H55S1G62MFP-A3 Datasheet HTML 5Page - Hynix Semiconductor H55S1G62MFP-A3 Datasheet HTML 6Page - Hynix Semiconductor H55S1G62MFP-A3 Datasheet HTML 7Page - Hynix Semiconductor H55S1G62MFP-A3 Datasheet HTML 8Page - Hynix Semiconductor H55S1G62MFP-A3 Datasheet HTML 9Page - Hynix Semiconductor Next Button
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Rev 1.2 / Jul. 2008
4
11
1Gbit (64Mx16bit) Mobile SDR Memory
H55S1G62MFP Series
INFORMATION for Hynix KNOWN GOOD DIE
With the advent of Mullti-Chip package (MCPs), Package on Package (PoP) and system in a package (SiP) applications,
customer demand for Known Good Die (KGD) has increased.
Requirements for smaller form factors and higher memory densities are fueling the need for Wafer-level memory solu-
tions due to their superior flexibility. Hynix Known Good Die (KGD) products can be used in packaging technologies
such as systems-in-a-package (SIPs) and multi-chip packages (MCPs) to reduce the board area required, making them
ideal for handheld PCs, and many other portable digital applications.
Hynix Mobile DRAM will be able to containue its constant effort of enabling the Advanced package products of all appli-
cation customers.
- Please Contact Hynix Office for Hynix KGD product availability and informations.


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