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SS06032R5ML 数据表(PDF) 1 Page - ABC Taiwan Electronics Corp |
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SS06032R5ML 数据表(HTML) 1 Page - ABC Taiwan Electronics Corp |
1 / 7 page REF : PAGE: 1 PROD. NAME ABC'S DWG NO. ABC'S ITEM NO. CONFIGURATION & DIMENSIONS Ⅰ﹒ : SCHEMATIC DIAGRAM Ⅱ﹒ : MATERIALS Ⅲ﹒ : aCoreFerrite DR core ﹒: c Wire Enamelled copper wire class F ﹒: ( ) eBaseLCP E4008 ﹒: dTerminalCu/Ni/Sn ﹒: fAdhesive Epoxy resin ﹒: A E H c Storage Temp. -40 ~ +125 ﹒: ℃ ℃ b Rated Current Base on temp. rise ﹒: GENERAL SPECIFICATION Ⅳ﹒ : a Temp. Rise 40 max. ﹒: ℃ d Operating Temp. -40 ~ +105 ﹒: ℃ ℃ e Resistance to solder heat 260 . 10 secs. ﹒: ℃ 1 0 1 A 6.5±0.3 : B 6.5±0.3 : C 3.1±0.3 : E 1.6±0.2 : D 0.8 : F 5.0 typ. : G 4.3 ref. : H 2.5 ref. : I 1.5 ref. : m/m ( PCB Pattern ) Inductance code Marking AE-001A SPECIFICATION FOR APPROVAL +0.2 - 0.3 POWER INDUCTOR SHIELDED SMD m/m m/m m/m m/m m/m m/m m/m m/m b Core Ferrite RI core ﹒: a b c f d e g Remark Lead content 200ppm max. ﹒: include ferrite & L / LOA=10% max. △ / sec max. +2.0 ~ 4.0℃ Reflow Area Time ( seconds ) 50 50 0 100 150 250 200 100 150 +4.0 / sec max. ℃ Max time above 200 70sec max. ℃: Max time above 230 50sec max. ℃: Peak Temp 260 max. :℃ Temperature Rising Area 150 ~ 200 / 60 ~ 120sec ℃ Preheat Area Peak Temperature: 200 250 260 ℃ 70sec max. 50sec max. 230 ℃ Forced Cooling Area -(1.0 ~ 5.0) / sec max. ℃ SS0603□□□□L□-□□□ |
类似零件编号 - SS06032R5ML |
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类似说明 - SS06032R5ML |
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