1

2

6

1Y

1OE

1A

7

5

3

2Y

2OE

2A

SN74AUP2G241

SCES761A – DECEMBER 2009 – REVISED DECEMBER 2009

www.ti.com

The SN74AUP2G241 is designed specifically to improve both the performance and density of 3-state

memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

preventing damaging current backflow through the device when it is powered down.

ORDERABLE PART NUMBER

NanoStar™ – WCSP (DSBGA)

Reel of 3000

SN74AUP2G241YFPR

_ _ H Q _

0.23-mm Large Bump – YFP (Pb-free)

uQFN – DQE

Reel of 5000

SN74AUP2G241DQER

HQ

–40°C to 85°C

QFN – RSE

Reel of 5000

SN74AUP2G241RSER

PREVIEW

SSOP – DCU

Reel of 3000

SN74AUP2G241DCUR

H41_

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site.

YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

● = Pb-free).

FUNCTION TABLES

INPUTS

OUTPUT

1Y

1OE

1A

L

H

H

L

L

L

H

X

Z

INPUTS

OUTPUT

2Y

2OE

2A

H

H

H

H

L

L

L

X

Z

LOGIC DIAGRAM (POSITIVE LOGIC)

Pin numbers shown are for DCU and DQE packages.

2

Submit Documentation Feedback

Copyright © 2009, Texas Instruments Incorporated

Product Folder Link(s): SN74AUP2G241