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NBXDPA019 数据表(PDF) 6 Page - ON Semiconductor |
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NBXDPA019 数据表(HTML) 6 Page - ON Semiconductor |
6 / 7 page NBXDPA019 http://onsemi.com 6 Table 8. RELIABILITY COMPLIANCE Parameter Standard Method Shock Mechanical MIL−STD−833, Method 2002, Condition B Solderability Mechanical MIL−STD−833, Method 2003 Vibration Mechanical MIL−STD−833, Method 2007, Condition A Solvent Resistance Mechanical MIL−STD−202, Method 215 Resistance to Soldering Heat Mechanical MIL−STD−203, Method 210, Condition I or J Thermal Shock Environment MIL−STD−833, Method 1001, Condition A Moisture Resistance Environment MIL−STD−833, Method 1004 Figure 5. Typical Termination for Output Driver and Device Evaluation Driver Device Receiver Device CLK D CLK D Zo = 50 W Zo = 50 W 100 W NBXDPA019 260 217 175 150 Temperature (°C) temp. 260°C 20 − 40 sec. max. Time 60180 sec. 3°C/sec. max. cooling 6°C/sec. max. 60150 sec. reflow peak pre−heat ramp−up Figure 6. Recommended Reflow Soldering Profile |
类似零件编号 - NBXDPA019 |
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类似说明 - NBXDPA019 |
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