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MC10XS3412DPNA 数据表(PDF) 7 Page - Freescale Semiconductor, Inc |
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MC10XS3412DPNA 数据表(HTML) 7 Page - Freescale Semiconductor, Inc |
7 / 53 page Analog Integrated Circuit Device Data Freescale Semiconductor 7 10XS3412 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS THERMAL RESISTANCE Thermal Resistance(7) Junction to Case Junction to Ambient RθJC RθJA <1.0 30 °C/W Peak Package Reflow Temperature During Reflow(8), (9) TPPRT Note 9 °C Notes 7. Device mounted on a 2s2p test board per JEDEC JESD51-2. 15 °C/W of RθJA can be reached in a real application case (4 layers board). 8. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 9. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics. Table 3. Maximum Ratings (continued) All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit |
类似零件编号 - MC10XS3412DPNA |
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类似说明 - MC10XS3412DPNA |
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