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MCP1702 数据表(PDF) 4 Page - Microchip Technology |
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MCP1702 数据表(HTML) 4 Page - Microchip Technology |
4 / 32 page MCP1702 DS22008D-page 4 © 2009 Microchip Technology Inc. Dropout Voltage (Note 1, Note 5) VDROPOUT — 330 650 mV IL = 250 mA, VR = 5.0V — 525 725 mV IL = 250 mA, 3.3V ≤ VR < 5.0V — 625 975 mV IL = 250 mA, 2.8V ≤ VR < 3.3V — 750 1100 mV IL = 250 mA, 2.5V ≤ VR < 2.8V —— — mV VR < 2.5V, See Maximum Output Current Parameter Output Delay Time TDELAY — 1000 — µs VIN = 0V to 6V, VOUT = 90% VR RL = 50Ω resistive Output Noise eN —8 — µV/(Hz)1/2 IL = 50 mA, f = 1 kHz, COUT = 1 µF Power Supply Ripple Rejection Ratio PSRR — 44 — dB f = 100 Hz, COUT = 1 µF, IL = 50 mA, VINAC = 100 mV pk-pk, CIN = 0 µF, VR =1.2V Thermal Shutdown Protection TSD — 150 — °C DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise specified, all limits are established for V IN = VOUT(MAX) + VDROPOUT(MAX), Note 1, ILOAD = 100 µA, COUT = 1 µF (X7R), CIN = 1 µF (X7R), TA = +25°C. Boldface type applies for junction temperatures, T J of -40°C to +125°C. (Note 7) Parameters Sym Min Typ Max Units Conditions Note 1: The minimum VIN must meet two conditions: VIN ≥ 2.7V and VIN ≥ VOUT(MAX) + VDROPOUT(MAX). 2: VR is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V. The input voltage VIN = VOUT(MAX) + VDROPOUT(MAX) or VIN = 2.7V (whichever is greater); IOUT = 100 µA. 3: TCVOUT = (VOUT-HIGH - VOUT-LOW) *10 6 / (V R * ΔTemperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range. 4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCVOUT. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured value with an applied input voltage of VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater. 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability. 7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant. |
类似零件编号 - MCP1702_09 |
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类似说明 - MCP1702_09 |
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