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TLV2780 数据表(PDF) 20 Page - Texas Instruments |
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TLV2780 数据表(HTML) 20 Page - Texas Instruments |
20 / 26 page Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) TLV2784CPWR ACTIVE TSSOP PW 14 2000 None CU NIPDAU Level-1-220C-UNLIM TLV2784ID ACTIVE SOIC D 14 50 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2784IDR ACTIVE SOIC D 14 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2784IN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPD Level-NC-NC-NC TLV2784IPW ACTIVE TSSOP PW 14 90 None CU NIPDAU Level-1-220C-UNLIM TLV2784IPWR ACTIVE TSSOP PW 14 2000 None CU NIPDAU Level-1-220C-UNLIM TLV2785AID ACTIVE SOIC D 16 40 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2785AIDR ACTIVE SOIC D 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2785AIPW ACTIVE TSSOP PW 16 90 None CU NIPDAU Level-1-220C-UNLIM TLV2785AIPWR ACTIVE TSSOP PW 16 2000 None CU NIPDAU Level-1-220C-UNLIM TLV2785CD ACTIVE SOIC D 16 40 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2785CDR ACTIVE SOIC D 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2785CPW ACTIVE TSSOP PW 16 90 None CU NIPDAU Level-1-220C-UNLIM TLV2785CPWR ACTIVE TSSOP PW 16 2000 None CU NIPDAU Level-1-220C-UNLIM TLV2785ID ACTIVE SOIC D 16 40 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2785IDR ACTIVE SOIC D 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2785IN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC TLV2785IPW ACTIVE TSSOP PW 16 90 None CU NIPDAU Level-1-220C-UNLIM TLV2785IPWR ACTIVE TSSOP PW 16 2000 None CU NIPDAU Level-1-220C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take PACKAGE OPTION ADDENDUM www.ti.com 22-Feb-2005 Addendum-Page 3 |
类似零件编号 - TLV2780 |
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类似说明 - TLV2780 |
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