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TLV2780 数据表(PDF) 16 Page - Texas Instruments |
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TLV2780 数据表(HTML) 16 Page - Texas Instruments |
16 / 26 page TLV2780, TLV2781, TLV2782, TLV2783, TLV2784, TLV2785, TLV278xA FAMILY OF 1.8 V HIGHSPEED RAILTORAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN SLOS245E − MARCH 2000 − REVISED JANUARY 2005 16 WWW.TI.COM APPLICATION INFORMATION general power dissipation considerations For a given θJA, the maximum power dissipation is shown in Figure 34 and is calculated by the following formula: P D + T MAX –T A q JA Where: PD = Maximum power dissipation of TLV278x IC (watts) TMAX = Absolute maximum junction temperature (150°C) TA = Free-ambient air temperature ( °C) θJA = θJC + θCA θJC = Thermal coefficient from junction to case θCA = Thermal coefficient from case to ambient air (°C/W) 1 0.75 0.5 0 −55 −40 −25 −10 5 1.25 1.5 MAXIMUM POWER DISSIPATION vs FREE-AIR TEMPERATURE 1.75 20 35 50 0.25 TA − Free-Air Temperature − °C 2 65 80 95 110 125 MSOP Package Low-K Test PCB θJA = 260°C/W TJ = 150°C PDIP Package Low-K Test PCB θJA = 104°C/W SOIC Package Low-K Test PCB θJA = 176°C/W SOT-23 Package Low-K Test PCB θJA = 324°C/W NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB. Figure 34. Maximum Power Dissipation vs Free-Air Temperature |
类似零件编号 - TLV2780 |
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类似说明 - TLV2780 |
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