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TL051AIP 数据表(PDF) 5 Page - Texas Instruments |
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TL051AIP 数据表(HTML) 5 Page - Texas Instruments |
5 / 65 page TL05x, TL05xA, TL05xY ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS SLOS178 – FEBRUARY 1997 5 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TL052Y chip information This chip, when properly assembled, displays characteristics similar to the TL052. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – 1OUT 1IN + 1IN – VCC+ (8) (6) (3) (2) (5) (1) – + (7) 2IN + 2IN – 2OUT (4) VCC – (1) (2) (3) (4) (5) (6) (7) (8) 66 72 |
类似零件编号 - TL051AIP |
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类似说明 - TL051AIP |
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