数据搜索系统,热门电子元器件搜索 |
|
TL081A 数据表(PDF) 5 Page - Texas Instruments |
|
|
TL081A 数据表(HTML) 5 Page - Texas Instruments |
5 / 29 page TL081, TL081A, TL081B, TL082, TL082A, TL082B TL082Y, TL084, TL084A, TL084B, TL084Y JFET-INPUT OPERATIONAL AMPLIFIERS SLOS081E – FEBRUARY 1977 – REVISED FEBRUARY 1999 5 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TL082Y chip information These chips, when properly assembled, display characteristics similar to the TL082. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – 1OUT 1IN + 1IN – VCC+ (8) (6) (3) (2) (5) (1) – + (7) 2IN + 2IN – 2OUT (4) VCC – 61 61 (7) (6) (5) (4) (8) (3) (2) (1) |
类似零件编号 - TL081A |
|
类似说明 - TL081A |
|
|
链接网址 |
隐私政策 |
ALLDATASHEETCN.COM |
ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |