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EPM240F100C 数据表(PDF) 51 Page - Altera Corporation |
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EPM240F100C 数据表(HTML) 51 Page - Altera Corporation |
51 / 86 page © October 2008 Altera Corporation MAX II Device Handbook 4. Hot Socketing and Power-On Reset in MAX II Devices Introduction MAX® II devices offer hot socketing, also known as hot plug-in or hot swap, and power sequencing support. Designers can insert or remove a MAX II board in a system during operation without undesirable effects to the system bus. The hot socketing feature removes some of the difficulties designers face when using components on printed circuit boards (PCBs) that contain a mixture of 3.3-, 2.5-, 1.8-, and 1.5-V devices. The MAX II device hot socketing feature provides: ■ Board or device insertion and removal ■ Support for any power-up sequence ■ Non-intrusive I/O buffers to system buses during hot insertion This chapter contains the following sections: ■ “MAX II Hot-Socketing Specifications” on page 4–1 ■ “Power-On Reset Circuitry” on page 4–5 MAX II Hot-Socketing Specifications MAX II devices offer all three of the features required for the hot-socketing capability listed above without any external components or special design requirements. The following are hot-socketing specifications: ■ The device can be driven before and during power-up or power-down without any damage to the device itself. ■ I/O pins remain tri-stated during power-up. The device does not drive out before or during power-up, thereby affecting other buses in operation. ■ Signal pins do not drive the VCCIO or VCCINT power supplies. External input signals to device I/O pins do not power the device VCCIO or VCCINT power supplies via internal paths. This is true if the VCCINT and the VCCIO supplies are held at GND. 1 Altera uses GND as reference for the hot-socketing and I/O buffers circuitry designs. You must connect the GND between boards before connecting the VCCINT and the VCCIO power supplies to ensure device reliability and compliance to the hot-socketing specifications. Devices Can Be Driven before Power-Up Signals can be driven into the MAX II device I/O pins and GCLK[3..0] pins before or during power-up or power-down without damaging the device. MAX II devices support any power-up or power-down sequence (VCCIO1, VCCIO2, VCCIO3, VCCIO4, VCCINT), simplifying the system-level design. MII51004-2.1 |
类似零件编号 - EPM240F100C |
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类似说明 - EPM240F100C |
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