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EP1C20F400I7ES 数据表(PDF) 4 Page - Altera Corporation

部件名 EP1C20F400I7ES
功能描述  Cyclone FPGA Family
Download  106 Pages
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制造商  ALTERA [Altera Corporation]
网页  http://www.altera.com
标志 ALTERA - Altera Corporation

EP1C20F400I7ES 数据表(HTML) 4 Page - Altera Corporation

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Altera Corporation
Preliminary
May 2008
Cyclone Device Handbook, Volume 1
Cyclone devices are available in quad flat pack (QFP) and space-saving
FineLine® BGA packages (see Tables 1–2 through 1–3).
Vertical migration means you can migrate a design from one device to
another that has the same dedicated pins, JTAG pins, and power pins, and
are subsets or supersets for a given package across device densities. The
largest density in any package has the highest number of power pins; you
must use the layout for the largest planned density in a package to
provide the necessary power pins for migration.
For I/O pin migration across densities, cross-reference the available I/O
pins using the device pin-outs for all planned densities of a given package
type to identify which I/O pins can be migrated. The Quartus® II
software can automatically cross-reference and place all pins for you
when given a device migration list. If one device has power or ground
pins, but these same pins are user I/O on a different device that is in the
migration path,the Quartus II software ensures the pins are not used as
user I/O in the Quartus II software. Ensure that these pins are connected
Total RAM bits
59,904
78,336
92,160
239,616
294,912
PLLs
12222
Maximum user I/O pins (1)
104
301
185
249
301
Note to Table 1–1:
(1)
This parameter includes global clock pins.
Table 1–1. Cyclone Device Features (Part 2 of 2)
Feature
EP1C3
EP1C4
EP1C6
EP1C12
EP1C20
Table 1–2. Cyclone Package Options and I/O Pin Counts
Device
100-Pin TQFP
(1)
144-Pin TQFP
(1), (2)
240-Pin PQFP
(1)
256-Pin
FineLine BGA
324-Pin
FineLine BGA
400-Pin
FineLine BGA
EP1C3
65
104
EP1C4
————
249
301
EP1C6
98
185
185
EP1C12
173
185
249
EP1C20
————
233
301
Notes to Table 1–2:
(1)
TQFP: thin quad flat pack.
PQFP: plastic quad flat pack.
(2)
Cyclone devices support vertical migration within the same package (i.e., designers can migrate between the
EP1C3 device in the 144-pin TQFP package and the EP1C6 device in the same package).


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