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EP3C80 数据表(PDF) 4 Page - Altera Corporation |
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EP3C80 数据表(HTML) 4 Page - Altera Corporation |
4 / 7 page 4 DS-CYTHRML-3.0 Altera Corporation Altera Device Package Information Data Sheet Table 4 provides θJA values and θJB (junction-to-board thermal resistance) values for Cyclone III devices on a typical board. U484 7 7 19 79 F324 6 6 19 79 F256 6 6 17 77 U256 6 6 14 74 Notes to Table 3: (1) Power layer Cu thickness 35 um, Cu 90% (2) Signal layer Cu thickness 17 um, Cu 15% Table 3. PCB Dimensions Notes (1), (2) (Part 2 of 2) 2.5 mm Thick Signal Layers Power/Ground Layers Package Dimensions (mm) Board Dimensions (mm) Table 4. Thermal Resistance of Cyclone III Devices for Typical Board (Part 1 of 2) Device Package θJA (°C/W) Still Air θJA (°C/W) 100 ft./min. θJA (°C/W) 200 ft./min. θJA (°C/W) 400 ft./min. θJB (°C/W) EP3C5 F256 32.2 27.9 25.5 23.6 17.3 U256 32.7 28.2 25.7 23.7 16.3 EP3C10 F256 32.2 27.9 25.5 23.6 17.3 U256 32.7 28.2 25.7 23.7 16.3 EP3C16 F256 28.4 24.2 21.8 20 13.5 U256 29 24.6 22.2 20.2 12.7 U484 26.3 22.1 19.9 18.1 12.4 F484 22.5 18.5 16.4 14.8 9.8 EP3C25 F256 27.5 23.2 20.9 19.1 12.6 U256 28.1 23.7 21.3 19.4 11.8 F324 26.4 22.3 20.1 18.3 12.4 EP3C40 F324 23.1 19 16.9 15.1 9.2 F484 22.3 18.2 16 14.3 8.5 U484 19.4 15.4 13.5 11.9 6.8 F780 17.6 13.9 12.1 10.7 6.7 EP3C55 U484 21.2 17.1 15 13.3 7.5 F484 18.6 14.6 12.6 11.1 6 F780 16.8 13.1 11.3 9.9 5.9 |
类似零件编号 - EP3C80 |
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类似说明 - EP3C80 |
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