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EP3C80 数据表(PDF) 3 Page - Altera Corporation |
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EP3C80 数据表(HTML) 3 Page - Altera Corporation |
3 / 7 page Altera Corporation DS-CYTHRML-3.0 3 Altera Device Package Information Data Sheet Table 3 provides board dimension information for each package. EP3C16 E144 20 17.5 15.4 14 8 Q240 27.2 24.7 22.1 17.8 4.3 F256 28.5 25.1 23.2 21.7 9.1 U256 28.8 25.4 23.5 22 9.7 U484 26.9 23.5 21.6 20.1 8.5 F484 22.9 19.4 17.7 16.2 6.9 M164 34.7 28 26.1 24.4 9.2 EP3C25 E144 20 17.5 15.4 14 7.8 Q240 27 24.5 21.8 17.6 4.2 F256 27.5 24.1 22.2 20.7 8.5 U256 27.9 24.5 22.6 21.1 9.1 F324 26.6 23.1 21.3 19.8 8 EP3C40 Q240 25.8 23.2 20.6 17 4 F324 23.2 19.7 18 16.5 5.9 U484 22.8 19.3 17.6 16.1 5.9 F484 19.8 16.3 14.6 13.2 4.8 F780 18.7 15.2 13.5 12.2 4.5 EP3C55 F484 21.6 18.2 16.4 15 5.1 U484 18.9 15.4 13.8 12.2 4.2 F780 17.8 14.4 12.7 11.4 3.9 EP3C80 U484 20.4 16.9 15.2 13.8 4.4 F484 18 14.5 12.9 11.5 3.6 F780 16.9 13.5 11.8 10.5 3.3 EP3C120 F484 17.1 13.7 12 10.7 3.1 F780 16 12.6 11 9.7 2.8 Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 2 of 2) Device Package θJA (°C/W) Still Air θJA (°C/W) 100 ft./min. θJA (°C/W) 200 ft./min. θJA (°C/W) 400 ft./min. θJC (°C/W) Table 3. PCB Dimensions Notes (1), (2) (Part 1 of 2) 2.5 mm Thick Signal Layers Power/Ground Layers Package Dimensions (mm) Board Dimensions (mm) F780 9 9 29 89 F484 7 7 23 83 |
类似零件编号 - EP3C80 |
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类似说明 - EP3C80 |
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